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1.Uniform Thickness
HITACHI Solder-Plated Copper Wire is specially produced by high-tech electroplating techniques to meet very stringent and under high-grade quality standards.


Type 1                         : TPA (Tin-Plated Annealed)
Size                             :  80oC,30V
Chemical Composition   :  UL 758
Plating Thickness          :  Any thickness between 2-16 micron

2.Applications

Lead wires of resistors, capacitors, inductors, condensers, flexible flat cables, electrical switches, jumper wires or other electronic components.



Quality Features :

a) Uniform thickness of solder-plating
b) Good adhesion between solder and copper
c) Stable solderability after high temperature heating
d) Good corrosion resistance and anti-oxidation
d) Smooth surface and free from rough deposits

3.Packing Style

No Items Contents
1. Packing Pack Spool
2. Type of Packing SP SF P-3 P-5
3. Winding Weight (kg) 22 3 5
4. Dimension (mm)
  A 278 278 130 160
  B 305 285 60 70
  C 261 218 110 114
  D 145 153 10 12
  E - - 20 20

Legend:

1) "SP" denotes Plastic Pack (recyclable)
2) "SF" denotes Fibre Pack (one-way)


4. Ordering Information

a) Contact us at mailto:sales@hitachicable.com.sg

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